![]() ![]() This is also the case for the Condenso series. Lower void rates can only be achieved with soldering processes where the molten solder is subjected to a vacuum. With the vacuum option for void-free (cavity-free) soldering with unleaded solders, the Condenso systems also meet an important requirement for manufacturing power electronics. Moreover, the heat transferred by vapor phase is uniform on all components of the PCB, reducing stresses during soldering. We would be happy to determine the most efficient system for your manufacturing process, taking all relevant processes such as throughput, assembly size, thermal mass and follow-up processes into account. Vapor phase soldering transfers heat at about 100-400 W/m 2 K, which is considerably higher than 10-60 W/m 2 K of heat transferred by convection reflow soldering. The application options for the Condenso series are as varied as their production. Whether it’s a batch operation, inline connection or continuous soldering, Rehm offers the highest degree of process reliability for all areas. The Condenso series system versions can be integrated into a wide range of manufacturing environments. Our systems let you adjust all parameters, such as pressure or temperature, flexibly – for the best soldering results that exactly match the requirements of your manufacturing.ĭo you process large and heavy boards for which condensation soldering is out of the question? Or do you want a system that you can reliably carry out vacuum processes with at any time? Then choose a Condenso series system that can be customised to your manufacturing environment! An optional vacuum module ensures void-free soldered joints – directly after the soldering process or as a pre-vacuum. In order to improve control of the condensation phase, Rehm has developed a patented injection process that allows the soldering procedure to be individually regulated. Our Condenso series can solder even the most difficult assemblies quickly and dependably, at temperatures up to 240☌. It offers direct IR heating providing a temperature of up to 450☌ and a heated surface of 314 x. The reflow oven is used primarily for the reflow soldering of surface mount electronic components to printed circuit boards (PCB). This oven is an ideal choice for reflow soldering, rapid thermal annealing, and brazing. The inert heat transfer medium used is perfluoropolyether (Galden ®). The SRO-716 IR vacuum reflow oven is the centerpiece of ATVs reflow soldering ovens and is ready to meet any process requirements. This makes it particularly suitable for processing large or high-mass boards in a stable process atmosphere. Heat transfer in condensation soldering is up to ten times higher than in convection soldering. Vacuum reflow soldering is a soldering process that involves the melting of solder in a vacuum environment. ![]() Bei der Herstellung von Dickschicht-Hybridschaltungen ist es das häufigste Lötverfahren. In condensation reflow soldering, or vapor-phase soldering, soldering is accomplished using a hot vapor. Der Begriff Reflow-Löten oder Wiederaufschmelzlöten (engl.: reflow soldering) bezeichnet ein in der Elektrotechnik gängiges Weichlötverfahren zum Löten von SMD -Bauteilen. ![]()
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